Title :
Structure and method of forming pillar bumps with controllable shape and size
Author :
Hsu, Hou-Jun ; Huang, Jung-Tang ; Lee, Kuo-Yu ; Tsai, Ting-Chiang
Author_Institution :
Inst. of Mech. & Electr. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
Abstract :
This paper relates to the method of formation and structure of pillar bump with shape and dimension controllable, it specifically relates to a technique that uses polishing and planarization technique to let all pillar bumps have dimension and shape matching the design.
Keywords :
planarisation; polishing; wafer level packaging; controllable shape; controllable size; pillar bump formation; pillar bump structure; planarization; polishing; shape matching; Copper; Packaging; Patents; Planarization; Shape; Substrates;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699657
