DocumentCode
2314024
Title
Development of a capillary coating technology with on-line detecting system and its application for silver conductive circuit patterning
Author
Pan, Po-Ting ; Hsu, Shu-Shen ; Wang, An-Bang
Author_Institution
Inst. of Appl. Mech., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
Printing technology becomes much more important for circuitry manufacture due to the advantages of high throughput, and low equipment cost. Nowadays, photolithography, screen printing and inkjet printing are the most popular technologies for producing PCB; however, photolithography has disadvantage of low material utility, screen printing is restricted for its low resolution and inkjet printing has limitation of using low viscosity fluid. In this paper, a novel direct patterning technology, the capillary coating technology, has been developed to pattern silver ink with viscosity around 220cP. This is a viscosity that is too low for screen printing but too high for ink jet printing. Different sizes of capillary tubes (10 μm - 200 μm) were used to directly "write" the arbitrary patterns of circuits on glass and pattern width of 12 μm were achieved. In order to control circuit morphologies and its electricity properties, e.g. width (W), thickness (T) resistance (R) and resistivity (ρ), the operation parameters have been investigated in different coating conditions, such as head diameter (D), coating velocity (V), tip-to-substrate distance (G) and liquid pressure head (H). A resistivity about 8 ~ 12 μΩcm of patterned conducting circuits has obtained by suitable drying and sintering conditions.
Keywords
ink jet printing; photolithography; printed circuits; substrates; PCB; capillary coating technology; capillary tubes; circuit morphologies; circuitry manufacture; coating velocity; direct patterning technology; electricity properties; head diameter; ink jet printing; inkjet printing; liquid pressure head; low viscosity fluid; online detecting system; pattern silver ink; photolithography; printing technology; screen printing; silver conductive circuit patterning; sintering; tip-to-substrate distance; Coatings; Conductivity; Films; Printing; Silver; Substrates; Capillary coating; Direct-writing; silver ink pattern;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699660
Filename
5699660
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