DocumentCode
2314087
Title
Assessing the impact of uncertainty in physics of failure analysis of BGA solder joints fatigue damage
Author
Wu, Mei-Ling
Author_Institution
Dept. of Mech. & Electro-Mech. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
Solder joint fatigue life models will be used for analysis in this paper. Identifying an approach for quantifying the combination of input and uncertainty would enable the determination of more realistic confidence limits on PoF predictions. Variability in the physical parameters can be addressed by existing stochastic methods, which are designed to propagate probability distributions on the parameters through a fixed model structure in order to estimate the statistics of interest on the model response quantities. This paper focuses on uncertainly analysis, that is, how the input data uncertainly affects the output data uncertainly. We are assuming the model is correct and are only dealing with uncertainties due to variations in inputs. Output uncertainty, uncertainly in the correction factor, is determined by Monte Carlo simulation.
Keywords
Monte Carlo methods; ball grid arrays; failure analysis; solders; BGA solder joints fatigue damage; Monte Carlo simulation; PoF predictions; ball grid array packaging; correction factor uncertainty; failure analysis; fixed model structure; model response quantities; physics uncertainty; probability distributions; stochastic methods; Analytical models; Fatigue; Mathematical model; Monte Carlo methods; Soldering; Uncertainty; Young´s modulus;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699664
Filename
5699664
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