• DocumentCode
    2314214
  • Title

    Impact 2010 — Paper US052

  • Author

    Marshall, Joshua A.

  • Author_Institution
    MacDermid Inc., Waterbury, CT, USA
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Keywords
    delamination; electronics packaging; dicyandiamide; halogenated FR4 materials; kiss step; lamination cycle; lead-free assembly; moisture absorption; packaging; premature delamination; red color formation; reflow conditions; trapped moisture; vacuum desiccation; Color; Delamination; Lamination; Materials; Moisture; Presses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699672
  • Filename
    5699672
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2314214