DocumentCode :
2314214
Title :
Impact 2010 — Paper US052
Author :
Marshall, Joshua A.
Author_Institution :
MacDermid Inc., Waterbury, CT, USA
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Keywords :
delamination; electronics packaging; dicyandiamide; halogenated FR4 materials; kiss step; lamination cycle; lead-free assembly; moisture absorption; packaging; premature delamination; red color formation; reflow conditions; trapped moisture; vacuum desiccation; Color; Delamination; Lamination; Materials; Moisture; Presses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699672
Filename :
5699672
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2314214
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