• DocumentCode
    2314501
  • Title

    A study for thermoelectric properties of Ni doped SiC sintered thermoelectric semiconductor

  • Author

    Okamoto, Yoichi ; Kato, Kazuhiko ; Morimoto, Jun ; Miyakswa, T.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Defense Acad., Kanagawa, Japan
  • fYear
    1997
  • fDate
    26-29 Aug 1997
  • Firstpage
    236
  • Lastpage
    239
  • Abstract
    The thermoelectric properties of the p-type SiC:Ni sintered thermoelectric semiconductor have been studied as functions of Ni concentration (from 0.5 wt.96 to 5.0 wt.95) and temperature (from RT to 700°C). The electrical resistivity decreases drastically for all the Ni concentration range compared with other dopants such as Cu, Al and B at room temperature. The electrical resistivity and thermoelectric power decrease with increasing temperature. The value of the figure of merit Z approaches 1.4×10-4 at around 700°C. The condition of the doped impurity atom Ni has also been studied magnetically. It is confirmed that Ni does not segregate in the SiC sintered sample. We conclude that Ni is well diffused into SiC and it is one of the most effective dopants for SiC-based thermoelectric materials
  • Keywords
    electrical resistivity; impurity distribution; nickel; semiconductor materials; silicon compounds; thermoelectric power; 20 to 700 degC; Ni concentration dependence; SiC:Ni; electrical resistivity; figure of merit; p-SiC:Ni; room temperature; sintered thermoelectric semiconductor; temperature dependence; thermoelectric power; thermoelectric properties; Electric resistance; Inorganic materials; Magnetic materials; Magnetic properties; Magnetic variables measurement; Semiconductor materials; Silicon carbide; Temperature distribution; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
  • Conference_Location
    Dresden
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4057-4
  • Type

    conf

  • DOI
    10.1109/ICT.1997.667093
  • Filename
    667093