Title :
In-situ acoustic thermometry and tomography for rapid thermal processing
Author :
Yong Jin Lee ; Degertekin, F.L. ; Jun Pei ; Khuri-Yakub, T. ; Saraswat, K.C.
Author_Institution :
Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA
Abstract :
Temperature dependent velocity of acoustic waves guided by the silicon wafer is used to measure its temperature from 20/spl deg/C to 1000/spl deg/C with attainable accuracy of /spl plusmn/1/spl deg/C. The acoustic temperature sensor has been installed and tested in a rapid thermal processing environment. Temperature mapping is obtained by measuring the acoustic wave velocity along different paths on the wafer and applying tomographic inversion techniques.<>
Keywords :
acoustic imaging; acoustic transducers; acoustic wave velocity; elemental semiconductors; rapid thermal processing; silicon; temperature measurement; 20 to 1000 C; Si; acoustic temperature sensor; acoustic thermometry; acoustic tomography; guided acoustic wave velocity; in-situ measurement; rapid thermal processing; silicon wafer; temperature mapping; tomographic inversion; Acoustic measurements; Acoustic testing; Acoustic waves; Rapid thermal processing; Silicon; Temperature dependence; Temperature measurement; Temperature sensors; Tomography; Velocity measurement;
Conference_Titel :
Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-1450-6
DOI :
10.1109/IEDM.1993.347369
