DocumentCode
2314942
Title
A SiC-CuC-Cu insulator for MHD generator channels
Author
Okuo ; Ookouchi ; Aoki, Yuya
Author_Institution
Electrotech. Lab., Tsukuba, Japan
fYear
1989
fDate
0-0 1989
Firstpage
67
Lastpage
68
Abstract
Summary Form only given, as follows. The authors have tested improved SiC-CuC-Cu elements and shown their effectiveness as regards permissible heat flux, safe thermal shock conditions, electrical leakage, and breakdown between adjacent elements. To clarify the design specifications for the new elements, they examined the parameters generating degradation or destruction of the element. Under operating conditions exceeding permissible levels, considerable deterioration due to the reaction of potassium with SiC and severe ablation were observed. EPMA observation of post-test samples under permissible conditions showed diffusion and formation of a carbon-rich layer on the working surface. A direct relationship between the penetration of potassium and sulfur and the deterioration was not clear, even after 20 h. The crystal structure of SiC showed no change under permissible operating conditions. However, crystal granulation occurred, and peeling of the corner portions and a decrease of bond strength in the CuC compliant were observed when the permissible surface temperature was exceeded.<>
Keywords
bonds (chemical); ceramics; copper compounds; crystal structure; diffusion in solids; electron probe analysis; insulation testing; magnetohydrodynamic convertors; silicon compounds; thermal insulating materials; C-rich layer; K; MHD generator channels; S; SiC-CuC-Cu insulator; ablation; bond strength; corner portion peeling; crystal granulation; crystal structure; degradation; destruction; deterioration; diffusion; electrical leakage; electron probe microanalysis; heat flux; safe thermal shock conditions; surface temperature; Ceramics; Chemical analysis; Copper compounds; Diffusion processes; Electron beam applications; Insulation testing; Magnetohydrodynamic conversion; Silicon compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 1989. IEEE Conference Record - Abstracts., 1989 IEEE International Conference on
Conference_Location
Buffalo, NY, USA
Type
conf
DOI
10.1109/PLASMA.1989.166039
Filename
166039
Link To Document