• DocumentCode
    2315175
  • Title

    ULSI DRAM/SIMOX with stacked capacitor cells for low-voltage operation

  • Author

    Eimori, T. ; Oashi, T. ; Kimura, H. ; Yamaguchi, Y. ; Iwamatsu, T. ; Tsuruda, T. ; Suma, M. ; Hidaka, H. ; Inoue, Y. ; Nishimura, T. ; Satoh, S. ; Miyoshi, H.

  • Author_Institution
    ULSI Lab., Mitsubishi Electr. Corp., Hyogo, Japan
  • fYear
    1993
  • fDate
    5-8 Dec. 1993
  • Firstpage
    45
  • Lastpage
    48
  • Abstract
    An SOI-DRAM test device was fabricated on thin-film SOI (Silicon On Insulator) structure with 0.5 /spl mu/m CMOS/SIMOX (Separation by IMplanted OXygen) technology. Field-shield isolation and polysilicon pad techniques were introduced for the specific problems to thin-film SOI devices such as the floating body effects and increase of parasitic source/drain resistance, respectively. Keeping the thin-film SOI from etching off during DRAM cell processing was especially cared by using high-selectivity ECR etching technology. The bit-line capacitance of the experimental SOI-DRAM is reduced by 25% and the /RAS access time is 30% faster compared with the equivalent Bulk-Si DRAM. Low voltage DRAM operation down to 2 V range is also observed.<>
  • Keywords
    CMOS integrated circuits; DRAM chips; SIMOX; VLSI; integrated circuit technology; metal-insulator-semiconductor devices; sputter etching; 0.5 micron; 2 V; CMOS/SIMOX technology; ECR etching; RAS access time; Si-SiO/sub 2/; ULSI DRAM; bit-line capacitance; fabrication; field-shield isolation; floating body effects; low-voltage operation; parasitic source/drain resistance; polysilicon pad; stacked capacitor cells; thin-film SOI devices; Capacitors; Etching; Insulator testing; Isolation technology; Oxygen; Random access memory; Semiconductor thin films; Silicon on insulator technology; Thin film devices; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-1450-6
  • Type

    conf

  • DOI
    10.1109/IEDM.1993.347402
  • Filename
    347402