DocumentCode :
2315209
Title :
Cell technology directions for advanced MPUs and other memory-embedded logic devices
Author :
Kinugawa, M. ; Kakumu, M.
Author_Institution :
Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
fYear :
1993
fDate :
5-8 Dec. 1993
Firstpage :
37
Lastpage :
40
Abstract :
In this paper, a guideline for optimum embedded memory structures for advanced MPUs and other memory-embedded logic devices is proposed. It is concluded that introduction of full CMOS cells is inevitable for future SRAMs operated under reduced power supply voltage conditions. Therefore, MPUs will continue to use full CMOS cells maintaining excellent process and transistor design compatibility with SRAMs. On the other hand, some advanced logic devices will use DRAM cells, since they require higher density rather than higher performance or better process compatibility.<>
Keywords :
CMOS integrated circuits; DRAM chips; SRAM chips; logic circuits; logic devices; microprocessor chips; CMOS cells; DRAM cells; SRAMs; advanced MPUs; advanced logic devices; cell technology; full CMOS cells; higher density; higher performance; memory-embedded logic devices; multiprocessor units; optimum embedded memory structures; process compatibility; reduced power supply voltage conditions; transistor design compatibility; Driver circuits; Guidelines; Logic devices; Power supplies; Process design; Random access memory; Semiconductor devices; Thin film transistors; Threshold voltage; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-1450-6
Type :
conf
DOI :
10.1109/IEDM.1993.347404
Filename :
347404
Link To Document :
بازگشت