• DocumentCode
    2316536
  • Title

    Comparative evaluation of glass conducting armour materials for form-wound stator coils

  • Author

    Stranges, M.K.W. ; Hayward, J.E. ; Omranipour, R. ; Dymond, J.H.

  • Author_Institution
    GE Canada Inc., Peterborough, Ont., Canada
  • fYear
    2004
  • fDate
    19-22 Sept. 2004
  • Firstpage
    216
  • Lastpage
    221
  • Abstract
    Semiconducting armour tape with a particulate-loaded binder is typically used for maintaining the ground potential plane within the slot section of a vacuum-pressure impregnated (ATI) stator coil. This paper compares the measured resistances as a function of distance from the ground plane for three commercially available semiconducting glass armour tapes. Results are presented from room temperature resistance tests performed before and after VPI processing, and from an elevated temperature cycle resistance test on the fully processed bars. Similar previous resistance tests and the relative merits of using woven glass and polyester fleece are discussed. The paper also describes results from voltage endurance (VE) tests on different conducting armour and groundwall configurations, and observations of surface deterioration under the ground plane.
  • Keywords
    glass; machine testing; materials testing; polymers; resins; stators; VPI processing; ground potential plane; particulate-loaded binder; polyester fleece; resistance measurement; room temperature resistance test; semiconducting glass armour tape; surface deterioration; temperature cycle resistance test; vacuum-pressure impregnated stator coil; voltage endurance test; woven glass; Coils; Conducting materials; Electrical resistance measurement; Glass; Land surface temperature; Performance evaluation; Semiconductivity; Semiconductor materials; Stators; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-8447-4
  • Type

    conf

  • DOI
    10.1109/ELINSL.2004.1380527
  • Filename
    1380527