DocumentCode :
2316721
Title :
[Front matter]
fYear :
2012
fDate :
18-20 April 2012
Firstpage :
1
Lastpage :
3
Abstract :
The following topics are dealt with: virtual prototyping; multiprocessor systems on chip; embedded processor behavior; SoC; embedded imaging; object recognition; signal processing; cache storage; SRAM; digital signal processors; real time operating systems; FPGA; IBM Blue Gene/Q Supercomputer; supercomputing and embedded computing; Tofu interconnect controller; highly scalable supercomputer; scalability and portability; 3D integration; through-chip interface; CMOS processors; multi-core architecture; multi-chip architecture; ultra low-power digital TV applications; nonvolatile logic-in-memory architecture; MTJ structure; MOS-hybrid structure; power gating and circuit; gate-level process variation offset technique; dual voltage supplies; NMOS; PMOS; and multithreaded processor.
Keywords :
CMOS integrated circuits; digital signal processing chips; embedded systems; field programmable gate arrays; low-power electronics; microprocessor chips; multi-threading; object recognition; parallel machines; power supply circuits; system-on-chip; three-dimensional integrated circuits; virtual prototyping; 3D integration; CMOS processors; FPGA; IBM Blue Gene/Q Supercomputer; MOS-hybrid structure; MTJ structure; NMOS; PMOS; SRAM; SoC; Tofu interconnect controller; cache storage; digital signal processors; dual voltage supply; embedded computing; embedded imaging; embedded processor behavior; gate-level process variation offset technique; highly scalable supercomputer; multichip architecture; multicore architecture; multiprocessor systems on chip; multithreaded processor; nonvolatile logic-in-memory architecture; object recognition; power circuit; power gating; real time operating systems; signal processing; supercomputing; through-chip interface; ultra low-power digital TV applications; virtual prototyping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Cool Chips XV (COOL Chips), 2012 IEEE
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-1201-1
Electronic_ISBN :
978-1-4673-1200-4
Type :
conf
DOI :
10.1109/COOLChips.2012.6216570
Filename :
6216570
Link To Document :
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