• DocumentCode
    2316958
  • Title

    A media-oriented vector architectural extension with a high bandwidth cache system

  • Author

    Gao, Ye ; Shoji, Naoki ; Egawa, Ryusuke ; Takizawa, Hiroyuki ; Kobayashi, Hiroaki

  • Author_Institution
    Grad. Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
  • fYear
    2012
  • fDate
    18-20 April 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Although modern SIMD extensions enable to improve the performance of MMAs, the limited parallel-processing capability and low memory bandwidth are their drawbacks to execute next generation MMAs. This paper proposes a novel media-oriented vector architectural extension (MVPX) to aim at accelerating a wide range of next generation MMAs. MVPX consists of an out-of-order vector processing mechanism (OVPM) and a high bandwidth cache system (MVP-cache). OVPM enables MVPX to take advantage of high data level parallelism for various MMAs. Meanwhile, MVP-cache can reduce the data transfer from/to off-chip memory accesses, and thus increase the sustained memory bandwidth by exploiting reusable vector data. It has a low power/area overhead approach to increasing memory bandwidth, compared with approaches to increasing the off-chip memory bandwidth. As a result, MVPX expands the potential of GPPs for next generation media processing in a power efficient way.
  • Keywords
    cache storage; MVP-cache; data transfer; high bandwidth cache system; high data level parallelism; limited parallel-processing capability; low memory bandwidth; media-oriented vector architectural extension; modern SIMD extension; next generation MMA; next generation media processing; off-chip memory access; off-chip memory bandwidth; out-of-order vector processing mechanism; reusable vector data; Bandwidth; Memory management; Pipelines; Power demand; Registers; Vectors; SIMD; cache; memory bandwidth; multimedia application; vector architecture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Cool Chips XV (COOL Chips), 2012 IEEE
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4673-1201-1
  • Electronic_ISBN
    978-1-4673-1200-4
  • Type

    conf

  • DOI
    10.1109/COOLChips.2012.6216588
  • Filename
    6216588