DocumentCode
2317189
Title
Rapid decomposition phenomena of polymer dielectrics in circuit breakers
Author
Asokan, T. ; Jacobs, Linda
Author_Institution
GE India Technol. Center, Bangalore, India
fYear
2004
fDate
19-22 Sept. 2004
Firstpage
280
Lastpage
283
Abstract
Under short circuit condition or current interruption, polymer dielectrics in circuit breakers are exposed to high temperatures and pressure for a short period. The short-term exposure of polymer surface results in rapid decomposition. The surface resistance of the polymer is found to vary significantly after the exposure, whilst the arc resistance is not affected significantly. FTIR -depth profile analysis revealed that the surface chemistry is altered up to a depth of about 60mm. Through X-ray photoelectron spectroscopy of the polymer surfaces, it is inferred that the ratio of C-H and C-O vary significantly, depending upon the type of polymer. Interestingly, polyester displayed more oxidation on the exposed surface and, contrarily, polycarbonate surface was found to have more carbon and its by-products. The dielectric performance of the breaker is discussed in relation to the surface chemistry modification.
Keywords
Fourier transform spectroscopy; X-ray photoelectron spectra; carbon; circuit breakers; circuit-breaking arcs; dielectric materials; infrared spectroscopy; oxidation; short-circuit currents; surface chemistry; FTIR; Fourier transform infrared spectroscopy; X-ray photoelectron spectroscopy; arc resistance; carbon; circuit breakers; current interruption; depth profile analysis; oxidation; polycarbonate surface; polyester; polymer dielectrics performance; polymer surface; rapid decomposition phenomena; short circuit condition; surface chemistry; surface resistance; Chemistry; Circuit breakers; Circuit testing; Dielectrics; Electric resistance; Polymers; Spectroscopy; Surface contamination; Surface resistance; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
ISSN
1089-084X
Print_ISBN
0-7803-8447-4
Type
conf
DOI
10.1109/ELINSL.2004.1380558
Filename
1380558
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