• DocumentCode
    2318447
  • Title

    Analysis of AC breakdown of composite-insulation depending on gas pressure and solid insulation thickness

  • Author

    Jung, Hae-Eun ; Yun, Jae-Hun ; Lee, Chung ; Kang, Seong-Hwa ; Cho, Kyu-Boek ; Lim, Kee-Joe

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Chungbuk Nat. Univ., Chungbuk
  • fYear
    2008
  • fDate
    21-24 April 2008
  • Firstpage
    325
  • Lastpage
    327
  • Abstract
    SF6 gas used widely as insulating component in electric power industry has excellent in insulation and arc extinguishing performance in gas-insulated switchgear. However, the concern about eco-friendly alternative gas is currently rising because SF6 gas is one of the main greenhouse gases. In this paper, dry-air and composite-insulation (dry-air + epoxy) as the alternative technology for SF6 gas insulation is studied. Under the gas pressure ranged from 0.1 to 0.6 MPa, the breakdown voltage of dry-air is measured in AC electric field. The data of composite-insulation are ac acquired by changing the thickness of epoxy used in each composite-insulation under the same condition. As a result, in case of dry-air, the gas pressure needs to be compressed as about 3 times as that of SF6 to maintain the same dielectric strength. When the epoxy is applied by the thickness, the breakdown voltage of composite-insulation is increased by the side of dry-air. However, the difference by the thickness does not exist almost.
  • Keywords
    composite insulators; electric breakdown; epoxy insulation; gaseous insulation; AC electric field; composite insulation; composite-insulation AC breakdown; dry-air insulation; dry-air-epoxy insulation; gas pressure; pressure 0.1 MPa to 0.6 MPa; solid insulation thickness; Dielectrics and electrical insulation; Electric breakdown; Electric fields; Electric variables measurement; Gas industry; Gas insulation; Global warming; Pressure measurement; Solids; Switchgear; ac breakdown voltage; composite insulation; dry air; solid insulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Condition Monitoring and Diagnosis, 2008. CMD 2008. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1621-9
  • Electronic_ISBN
    978-1-4244-1622-6
  • Type

    conf

  • DOI
    10.1109/CMD.2008.4580293
  • Filename
    4580293