Title :
Comparisons of the thermoelectric properties of n-type PbTe fabricated with different powder processing methods
Author :
Choi, Jae-Shik ; Kim, Hee-Jeong ; Kim, Hang-Chong ; Hyun, Dow-Bin ; Oh, Tae-Sung
Author_Institution :
Dept. of Metall. & Mater. Sci., Hong Ik Univ., Seoul, South Korea
Abstract :
Bi-doped n-type PbTe powders were fabricated by mechanical alloying and melting/grinding to compare the thermoelectric properties of the alloys with powder processing methods. Hot pressing of the PbTe powders was conducted at 650°C and 750°C for 1 hour in vacuum. When measured at temperatures ranging from 25°C to 450°C, PbTe samples fabricated by mechanical alloying exhibited more negative Seebeck coefficient, higher electrical resistivity and lower thermal conductivity, compared to ones prepared by melting/grinding. The temperature for the maximum figure-of-merit shifted to lower temperature for the specimens fabricated by mechanical alloying. When hot pressed at 650°C, 0.3 wt% Bi-doped PbTe fabricated by mechanical alloying and melting/grinding exhibited a maximum figure-of-merit of 1.33×10 -3/K at 200°C and 1.07×10-3/K at 350°C, respectively
Keywords :
IV-VI semiconductors; Seebeck effect; bismuth; electrical resistivity; grinding; hot pressing; lead compounds; mechanical alloying; melting; powder technology; powders; thermal conductivity; thermoelectricity; 1 h; 25 to 450 degC; 650 degC; 750 degC; PbTe:Bi; Seebeck coefficient; electrical resistivity; hot pressing; maximum figure-of-merit temperature; mechanical alloying; melting/grinding; n-PbTe:Bi; powder processing methods; temperature dependence; thermal conductivity; thermoelectric properties; Alloying; Conductivity measurement; Electric variables measurement; Mechanical factors; Mechanical variables measurement; Powders; Pressing; Temperature measurement; Thermal conductivity; Thermoelectricity;
Conference_Titel :
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location :
Dresden
Print_ISBN :
0-7803-4057-4
DOI :
10.1109/ICT.1997.667120