DocumentCode :
2319285
Title :
The low friction of a diamond/H-terminated Si[111] sliding system
Author :
Masuda, H. ; Honda, F.
Author_Institution :
Aisin Seiki Co., Ltd, Aichi, Japan
fYear :
2002
fDate :
27-29 Aug. 2002
Abstract :
Hydrogen-terminated Si[111] surfaces have been studied for tribological performance in sliding of a diamond slider to obtain fundamental information on contact problems between a Si memory disk and the slider. We focused on the tribological role of the atoms on the contact surfaces, and observed an extra-ordinarily low coefficient of friction: 0.003 of the relevant sliding surfaces, a coefficient as low as the sliding system of diamond/Ag monolayer/Si[111]. The observed friction reduction of 2-orders was attributed to a monolayer of hydrogen atoms terminating the Si[111] dangling bonds. The results are discussed in terms of the sliding mechanism, surface source of friction and application to reduce memory disk surface damage as the result of probable contact between slider and disk, reduction of the friction of micro-machine sliding system, and design of a sliding system in a vacuum.
Keywords :
dangling bonds; diamond; hydrogen compounds; lubrication; magnetic recording; monolayers; silicon compounds; sliding friction; vacuum techniques; Ag-Si; C; SiH; coefficient of friction; contact surface atoms; diamond slider tribological performance; diamond/Ag monolayer/Si[111] sliding surfaces; friction reduction; hydrogen-terminated Si[111] surfaces; low friction magnetic memory disk sliding system; lubrication; memory disk surface damage reduction; memory disk/slider contact problems; micro-machine sliding system; silicon dangling bond hydrogen atom terminating monolayer; sliding mechanism; surface friction source; thin film devices; vacuum sliding system; vacuum technology; Atomic layer deposition; Atomic measurements; Friction; Hydrogen; Lubrication; Solids; Space technology; Surface cleaning; Vacuum systems; Vacuum technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetic Recording Conference, 2002. Digest of the Asia-Pacific
Conference_Location :
Singapore
Print_ISBN :
0-7803-7509-2
Type :
conf
DOI :
10.1109/APMRC.2002.1037648
Filename :
1037648
Link To Document :
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