• DocumentCode
    2319723
  • Title

    Electroluminescence test to evaluate dielectric property at the interface between semiconductive shield and insulation

  • Author

    Han, S. Joon ; Gross, Laurence H.

  • Author_Institution
    Dow Chem. Co., Somerset, NJ, USA
  • fYear
    2004
  • fDate
    19-22 Sept. 2004
  • Firstpage
    523
  • Lastpage
    526
  • Abstract
    The electroluminescence test is a relatively new technique to investigate the dielectric performance of semiconductive shields and crosslinked polyethylene insulation interfaces. It is based on the electric field (voltage) at which light emission occurs as a result of charge injection and carriers recombination for a given sample geometry. A standardized sample geometry with a semicon needle-plane electrode was utilized under amplified voltage in a dry condition to monitor the electroluminescence inception voltages of crosslinked polyethylene (XLPE) and tree retardant crosslinked polyethylene insulation (TR XLPE). It resulted that EL inception voltage of TR XLPE is higher than that of XLPE. In water tree growth test, TR XLPE demonstrated to retard water tree growth under the wet aging condition.
  • Keywords
    XLPE insulation; ageing; cable shielding; charge injection; electroluminescence; insulation testing; organic semiconductors; power cable insulation; power cable testing; trees (electrical); TR XLPE; XLPE; carriers recombination; charge injection; dielectric property; electric field; electroluminescence inception voltages; electroluminescence test; semicon needle-plane electrode; semiconductive shield; semiconductor insulation; standardized sample geometry; tree retardant crosslinked polyethylene insulation; water tree growth test; wet aging condition; Dielectrics and electrical insulation; Electrodes; Electroluminescence; Geometry; Insulation testing; Polyethylene; Radiative recombination; Semiconductor device testing; Trees - insulation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-8447-4
  • Type

    conf

  • DOI
    10.1109/ELINSL.2004.1380675
  • Filename
    1380675