Title :
Novel HDI microwave chip on flex (MCOF) broadside coupler designs
Author :
Teti, R.J. ; Hayes, R.E.
Author_Institution :
Lockheed Martin Naval Electron. & Surveillance Syst., Moorestown, NJ, USA
Abstract :
We describe the design, construction and performance of a family of broadside couplers implemented in Lockheed Martin´s proprietary High Density Interconnect (HDI) Microwave Chip on Flex (MCOF) technology. Integral realization of these overlay couplers in MCOF is a significant layout advantage and cost reduction of advanced microwave T/R modules, which are at the heart of next generation phased array radars. The couplers exhibit wide bandwidth and an excellent match.
Keywords :
Chip-on-board packaging; Phased array radar; Radar equipment; Transceivers; Waveguide couplers; HDI microwave chip on flex; High Density Interconnect; Lockheed Martin; MCOF; bandwidth; broadside coupler; cost reduction; microwave T/R modules; next generation phased array radars; overlay couplers; Costs; Coupling circuits; Integrated circuit interconnections; Metallization; Microwave technology; Phased arrays; Power amplifiers; Radio frequency; Routing; Surveillance;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.861759
