Title :
Architecture of a vertically stacked reconfigurable computer
Author :
Stevenson, Daniel S. ; Conn, Robert O.
Abstract :
This paper describes a scalable reconfigurable computing system using a Silicon circuit board (SiCB) design approach. The design involves attachment of unpackaged FPGA and memory die to wafer scale silicon substrates. The resulting reconfigurable computing system has substantial density, cost, and power consumption and performance improvements relative to other known integration or construction methods. A description of the SiCB technology and detailed advantages are provided. In addition, the reconfigurable computer architecture resulting from the use of SiCBs is described.
Keywords :
elemental semiconductors; field programmable gate arrays; printed circuit design; silicon; substrates; FPGA; memory; silicon circuit board design; vertically stacked reconfigurable computer; wafer scale silicon substrates; Computer architecture; Energy consumption; Fabrication; Field programmable gate arrays; Integrated circuit interconnections; Integrated circuit technology; Packaging; Printed circuits; Sensor arrays; Silicon on insulator technology; Computer architecture; field programmable gate arrays; reconfigurable architectures; vertically integrated packaging; wafer scale;
Conference_Titel :
High-Performance Reconfigurable Computing Technology and Applications, 2008. HPRCTA 2008. Second International Workshop on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-2826-7
DOI :
10.1109/HPRCTA.2008.4745678