Reliability tests on micro-insert die bonding technology

Author

Nowodzinski, Antoine ; Boutry, Herve ; Franiatte, Remy ; Mandrillon, Vincent ; Anciant, Romain ; Verrun, Sophie ; Simon, Gilles

Author_Institution

Dept. of Silicon Component, CEA, Grenoble, France

fYear

2012

fDate

24-26 Sept. 2012

Firstpage

83

Lastpage

87

Abstract

Micro-insert technology is a wafer level stacking technology offering main advantages such as simplicity, low cost and compatibility with chip assembly technologies. This paper presents recent preliminary reliability tests results. Thermal cycling tests between -40°C and 125°C and damp heat tests at 85%RH/85°C are performed, tests results show that micro-insert technology is very robust. A interesting correlation is found between initial interconnection electrical resistance and time to failure during damp heat test, allowing die sorting for reliability.

Keywords

bonding processes; microassembling; reliability; wafer level packaging; chip assembly technologies; damp heat tests; die sorting; initial interconnection electrical resistance; microinsert die bonding technology; preliminary reliability tests; temperature -40 degC to 125 degC; thermal cycling tests; wafer level stacking technology; Aluminum; Annealing; Force; Polymers; Semiconductor device reliability; Spectroscopy; Reliability; die-bonding; micro-bump; micro-insert;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference Dresden-Grenoble (ISCDG), 2012 International

Conference_Location

Grenoble

Print_ISBN

978-1-4673-1717-7

Type

conf

DOI

10.1109/ISCDG.2012.6359983

Filename

6359983