Title :
A compact PA MMIC module for K-band high-speed wireless systems
Author :
Satoh, T. ; Shimura, T. ; Ichikawa, S. ; Betti-Berutto, A. ; Poledrelli, C. ; Furukawa, Y. ; Hasegawa, Y. ; Kuroda, S. ; Fukaya, J.
Author_Institution :
Fujitsu Quantum Devices Ltd., Yamanashi, Japan
Abstract :
A K-band high-power MMIC amplifier module in a low-cost metal-ceramic package has been developed to provide an easy insertion of PA MMICs into K-band high-speed wireless systems. This PA module is comprised of a driver amplifier MMIC and a power amplifier MMIC with a total gain of 30 dB and a P/sub 1 dB/ of 33.5 dBm at frequencies between 23 and 26 GHz. The total performance of this module, G(dB)/spl times//spl Delta/f/f/sub 0/ is two times higher than previously reported works.
Keywords :
Driver circuits; Field effect MMIC; HEMT integrated circuits; MMIC power amplifiers; Microwave links; Multichip modules; Power integrated circuits; 23 to 26 GHz; 30 dB; K-band high-speed wireless systems; MCM; SHF; compact PA MMIC module; driver amplifier MMIC; high-power MMIC amplifier module; low-cost metal-ceramic package; power amplifier MMIC; Bandwidth; Driver circuits; Frequency; Impedance; K-band; MMICs; PHEMTs; Packaging; Power amplifiers; Power generation;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.861766
