A compact PA MMIC module for K-band high-speed wireless systems

Author

Satoh, T. ; Shimura, T. ; Ichikawa, S. ; Betti-Berutto, A. ; Poledrelli, C. ; Furukawa, Y. ; Hasegawa, Y. ; Kuroda, S. ; Fukaya, J.

Author_Institution

Fujitsu Quantum Devices Ltd., Yamanashi, Japan

Volume

3

fYear

2000

fDate

11-16 June 2000

Firstpage

1333

Abstract

A K-band high-power MMIC amplifier module in a low-cost metal-ceramic package has been developed to provide an easy insertion of PA MMICs into K-band high-speed wireless systems. This PA module is comprised of a driver amplifier MMIC and a power amplifier MMIC with a total gain of 30 dB and a P/sub 1 dB/ of 33.5 dBm at frequencies between 23 and 26 GHz. The total performance of this module, G(dB)/spl times//spl Delta/f/f/sub 0/ is two times higher than previously reported works.

Keywords

Driver circuits; Field effect MMIC; HEMT integrated circuits; MMIC power amplifiers; Microwave links; Multichip modules; Power integrated circuits; 23 to 26 GHz; 30 dB; K-band high-speed wireless systems; MCM; SHF; compact PA MMIC module; driver amplifier MMIC; high-power MMIC amplifier module; low-cost metal-ceramic package; power amplifier MMIC; Bandwidth; Driver circuits; Frequency; Impedance; K-band; MMICs; PHEMTs; Packaging; Power amplifiers; Power generation;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest. 2000 IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-7803-5687-X

Type

conf

DOI

10.1109/MWSYM.2000.861766

Filename

861766