• DocumentCode
    2320767
  • Title

    Advances in high & kappa gate dielectrics for Si and III-V semiconductors

  • Author

    Kwo, J. ; Hong, M. ; Busch, B. ; Muller, D.A. ; Chabal, Y.J. ; Kortan, A.R. ; Mannaerts, J.P. ; Yang, B. ; Ye, P. ; Gossmann, H. ; Sergent, A.M. ; Ng, K.K. ; Bude, J. ; Schulte, W.H. ; Garfunkel, E. ; Gustafsson, T.

  • Author_Institution
    Agere Syst., Murray Hill, NJ, USA
  • fYear
    2002
  • fDate
    15-20 Sept. 2002
  • Firstpage
    47
  • Lastpage
    48
  • Abstract
    Nanoscale device technology is driving intense study of thin dielectric layers on semiconductors. The aggressive scaling of Si CMOS technology calls for identifying high /spl kappa/ dielectrics to replace SiO/sub 2/ and oxynitrides in gate related applications. The material, requirements for the alternative gate dielectric are very challenging in order to achieve performance comparable to SiO/sub 2/. Furthermore, there are demanding issues for process integration compatibility. Among several binary oxides proposed the rare earth oxides are attractive candidates based on thermodynamic energy considerations and a high conduction band offset over 2eV. The interest in the rare earth oxide stems from our earlier work on GaAs passivation. The Ga/sub 2-x/Gd/sub x/O/sub 3/ mixed oxides (/spl kappa/ =12) and the Gd/sub 2/O/sub 3/ oxides (/spl kappa/ =14) films grown by ultrahigh vacuum deposition from an oxide source formed an excellent insulating barrier with low interfacial state density D/sub it/ on the GaAs surface. This discovery has led to the first GaAs based inversion channel MOSFET devices. These dielectrics were also successfully applied to other III-V semiconductors including InGaAs, AlGaAs, InP, and GaN producing MOS diodes and MOSFETs.
  • Keywords
    MIS devices; MOSFET; dielectric thin films; gadolinium compounds; gallium compounds; permittivity; semiconductor-insulator boundaries; vacuum deposited coatings; 2 eV; Ga/sub 2-x/Gd/sub x/O/sub 3/; Ga/sub 2-x/Gd/sub x/O/sub 3/ mixed oxides; GaAs; GaAs surface; Gd/sub 2/O/sub 3/; Gd/sub 2/O/sub 3/ oxides; Si; Si CMOS technology; aggressive scaling; dielectric constant; high /spl kappa/ dielectrics; inversion channel MOSFET; low interfacial state density; thin dielectric layers; ultrahigh vacuum deposition; CMOS technology; Dielectric devices; Dielectric materials; Dielectrics and electrical insulation; Gallium arsenide; III-V semiconductor materials; MOSFET circuits; Nanoscale devices; Passivation; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Molecular Beam Epitaxy, 2002 International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-7581-5
  • Type

    conf

  • DOI
    10.1109/MBE.2002.1037753
  • Filename
    1037753