DocumentCode :
2320767
Title :
Advances in high & kappa gate dielectrics for Si and III-V semiconductors
Author :
Kwo, J. ; Hong, M. ; Busch, B. ; Muller, D.A. ; Chabal, Y.J. ; Kortan, A.R. ; Mannaerts, J.P. ; Yang, B. ; Ye, P. ; Gossmann, H. ; Sergent, A.M. ; Ng, K.K. ; Bude, J. ; Schulte, W.H. ; Garfunkel, E. ; Gustafsson, T.
Author_Institution :
Agere Syst., Murray Hill, NJ, USA
fYear :
2002
fDate :
15-20 Sept. 2002
Firstpage :
47
Lastpage :
48
Abstract :
Nanoscale device technology is driving intense study of thin dielectric layers on semiconductors. The aggressive scaling of Si CMOS technology calls for identifying high /spl kappa/ dielectrics to replace SiO/sub 2/ and oxynitrides in gate related applications. The material, requirements for the alternative gate dielectric are very challenging in order to achieve performance comparable to SiO/sub 2/. Furthermore, there are demanding issues for process integration compatibility. Among several binary oxides proposed the rare earth oxides are attractive candidates based on thermodynamic energy considerations and a high conduction band offset over 2eV. The interest in the rare earth oxide stems from our earlier work on GaAs passivation. The Ga/sub 2-x/Gd/sub x/O/sub 3/ mixed oxides (/spl kappa/ =12) and the Gd/sub 2/O/sub 3/ oxides (/spl kappa/ =14) films grown by ultrahigh vacuum deposition from an oxide source formed an excellent insulating barrier with low interfacial state density D/sub it/ on the GaAs surface. This discovery has led to the first GaAs based inversion channel MOSFET devices. These dielectrics were also successfully applied to other III-V semiconductors including InGaAs, AlGaAs, InP, and GaN producing MOS diodes and MOSFETs.
Keywords :
MIS devices; MOSFET; dielectric thin films; gadolinium compounds; gallium compounds; permittivity; semiconductor-insulator boundaries; vacuum deposited coatings; 2 eV; Ga/sub 2-x/Gd/sub x/O/sub 3/; Ga/sub 2-x/Gd/sub x/O/sub 3/ mixed oxides; GaAs; GaAs surface; Gd/sub 2/O/sub 3/; Gd/sub 2/O/sub 3/ oxides; Si; Si CMOS technology; aggressive scaling; dielectric constant; high /spl kappa/ dielectrics; inversion channel MOSFET; low interfacial state density; thin dielectric layers; ultrahigh vacuum deposition; CMOS technology; Dielectric devices; Dielectric materials; Dielectrics and electrical insulation; Gallium arsenide; III-V semiconductor materials; MOSFET circuits; Nanoscale devices; Passivation; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Molecular Beam Epitaxy, 2002 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7581-5
Type :
conf
DOI :
10.1109/MBE.2002.1037753
Filename :
1037753
Link To Document :
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