• DocumentCode
    2321704
  • Title

    Thermoelectric properties of segmented Pb-Te systems with graded carrier concentrations

  • Author

    Shinohara, Y. ; Imai, Y. ; Isoda, Y. ; Nishida, I.A. ; Kaibe, H.T. ; Shiota, I.

  • Author_Institution
    Nat. Inst. for Metals, Sengen, Japan
  • fYear
    1997
  • fDate
    26-29 Aug 1997
  • Firstpage
    386
  • Lastpage
    389
  • Abstract
    Thermoelectric properties have been investigated on n-type PbTe material composed of 2 segments with different electron concentrations ne. The 2-segment material was prepared by liquid state diffusion bonding of two kinds of solidified ingots. ne of the ingots were 3×1024 and 6×1025/m3. The ingot of 3×1024/m3 had higher power factor below 500 K, while the ingot of 6×1025/m3 had higher factor above 500 K. The ingot with higher ne was for higher temperature use. When the temperature difference was given with the jointed interface of more than 450 K, the 2-segment material was found to give higher maximum power than the original ingots. From these results, the segmentation with graded ne is effective in improving the power generating performance of n-type PbTe
  • Keywords
    IV-VI semiconductors; electron density; lead compounds; thermoelectric conversion; thermoelectric power; wafer bonding; 2-segment material; 450 to 500 K; PbTe; electron concentrations; graded carrier concentrations; jointed interface; liquid state diffusion bonding; n-type PbTe material; power factor; power generating performance; segmented Pb-Te systems; temperature difference; thermoelectric properties; Conducting materials; Electric resistance; Electrical resistance measurement; Electrons; Joining materials; Resistance heating; Temperature dependence; Thermal conductivity; Thermal resistance; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
  • Conference_Location
    Dresden
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4057-4
  • Type

    conf

  • DOI
    10.1109/ICT.1997.667159
  • Filename
    667159