• DocumentCode
    2322160
  • Title

    Recognition of partial discharge defects in cable terminations

  • Author

    Lee, Chang-Hsing ; Lin Yu-Chih ; Chiu, Min-Yen ; Huang Chih-Hsien ; Yen, Shih-Shong ; Haeng, Chiang

  • Author_Institution
    Chan-Ching Electr. Tech. Consulting CO.Ltd., Hsinchu
  • fYear
    2008
  • fDate
    21-24 April 2008
  • Firstpage
    1242
  • Lastpage
    1245
  • Abstract
    As reported in very researches, the majority failure mechanism in cable terminations is predominantly involving partial discharge deterioration caused by voids, contaminants and protrusion. The partial discharge measurement is an effective way to detect such defects. However, no research shows the relation between the magnitude of partial discharge and remaining life of cable termination. Hence, it is hard to make decision to replace the unqualified cable termination immediately or lately for an in-service cable termination, while the partial discharge activities are measured. Based on authorspsila experiences, different defects have different ageing speed to breakdown. Therefore, recognition of defects is an alternative way to assess the degree of risks. This paper sets up a series test to figure out the properties of partial discharge activities caused by different defects, including wrong position of stress cone, void left, tape left, and needle pricked. Test results show the different properties of different defects, and these characteristics can be used to recognize defects inside cable termination.
  • Keywords
    partial discharge measurement; power cables; remaining life assessment; ageing; cable terminations; contaminants; partial discharge defects recognition; partial discharge deterioration; partial discharge measurement; protrusion; voids; Aging; Character recognition; Electric breakdown; Failure analysis; Needles; Partial discharge measurement; Partial discharges; Pollution measurement; Stress; Testing; cable insulation; partial discharge; recognition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Condition Monitoring and Diagnosis, 2008. CMD 2008. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1621-9
  • Electronic_ISBN
    978-1-4244-1622-6
  • Type

    conf

  • DOI
    10.1109/CMD.2008.4580513
  • Filename
    4580513