Title :
A genetic algorithm approach to VLSI macro cell non-slicing floorplans using binary tree
Author :
Rahim, Hasliza A. ; Rahman, Ab Al-Hadi Ab ; Andaljayalakshmi, G. ; Ahmad, R.B. ; Arrifin, Wan Nur Suryani Firuz Wan
Author_Institution :
Sch. of Comput. & Commun. Eng., Univ. Malaysia Perlis, Kuala Perlis
Abstract :
This paper proposes an optimization approach for macro-cell placement which minimizes the chip area size. A binary tree method for non-slicing tree construction process is utilized for the placement and area optimization of macro-cell layout in very large scaled integrated (VLSI) design. Three different types of genetic algorithms: simple genetic algorithm (SGA), steady-state algorithm (SSGA) and adaptive genetic algorithm (AGA) are employed in order to examine their performances in converging to their global minimums. Experimental results on Microelectronics Center of North Carolina (MCNC) benchmark problems show that the developed algorithm achieves an acceptable performance quality to the slicing floorplan. Furthermore, the robustness of genetic algorithm also has been investigated in order to validate the performance stability in achieving the optimal solution for every runtime. This algorithm demonstrates that SSGA converges to the optimal result faster than SGA and AGA. Besides that, SSGA also outperforms SGA and AGA in terms of robustness.
Keywords :
VLSI; genetic algorithms; integrated circuit layout; integrated logic circuits; trees (mathematics); MCNC benchmark problems; Microelectronics Center of North Carolina; VLSI macro cell nonslicing floorplans; adaptive genetic algorithm; binary tree method; chip area size minimization; nonslicing tree construction process; simple genetic algorithm; steady-state algorithm; Binary trees; Design optimization; Genetic algorithms; Genetic engineering; Mechanical factors; Microelectronics; Robust stability; Simulated annealing; Turing machines; Very large scale integration;
Conference_Titel :
Computer and Communication Engineering, 2008. ICCCE 2008. International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-1691-2
Electronic_ISBN :
978-1-4244-1692-9
DOI :
10.1109/ICCCE.2008.4580562