• DocumentCode
    2323172
  • Title

    On the Verification of Strong Atomicity in Programs Using STM

  • Author

    Li, Yong ; Zhang, Yu ; Chen, Yiyun ; Fu, Ming

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Univ. of Sci. & Technol. of China, Hefei, China
  • fYear
    2009
  • fDate
    8-10 July 2009
  • Firstpage
    123
  • Lastpage
    131
  • Abstract
    Transactional memory(TM) provides an easy-using and high-performance parallel programming model for multicore systems. It simplifies parallel programming by supporting that transactions appear to execute atomically and in isolation. Despite the large amount of recent works on various TM implementations, very little has been devoted to precisely guarantee that these implementations have implemented the atomicity and isolation properties. In previous work we have proposed a framework on the correctness of STM programs by formally certifying the shared memory invariant at assembly level. Now the framework is extended and we certify the strong atomicity property of programs using STM in this paper. In particular, we formalize the strong atomicity as the shared memory consistence of states in our model and use a notion of "local guarantee" to check the shared memory consistence for verification. Our work provides a foundation for certifying realistic transactional programs and makes an important advance toward generating proof-carrying code.
  • Keywords
    parallel programming; program verification; shared memory systems; STM; atomicity; multicore systems; parallel programming; program verification; proof-carrying code; shared memory; transactional memory; Assembly; Computer science; Computer security; Concurrent computing; Hardware; Laboratories; Memory management; Multicore processing; Parallel programming; Programming profession; proof-carrying code; strong atomicity; transactional memory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Secure Software Integration and Reliability Improvement, 2009. SSIRI 2009. Third IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3758-0
  • Type

    conf

  • DOI
    10.1109/SSIRI.2009.8
  • Filename
    5325383