DocumentCode
2323174
Title
A functional test comparison between mica over bare copper and double polyester glass over heavy polyester-amide imide insulation for high voltage multiturn coils
Author
Williams, Joseph A., III
Author_Institution
Electrolock Inc., Hiram, OH, USA
fYear
2003
fDate
23-25 Sept. 2003
Firstpage
595
Lastpage
598
Abstract
Many European and Asian manufacturers of high voltage multiturn coils have selected mica over bare copper as their preferred turn insulation rather than the double polyester glass over heavy polyester-amide imide film that is often used in the United States. A functional test program was developed to look at the process, performance and cost tradeoffs of both systems. A set of 6 test coils each were produced with both turn insulations. The manufacturing process was monitored and production observations are included in this report. All test coils were insulated with the same uncalcined muscovite mica ground wall tape and then impregnated with the same anhydride epoxy resin. The coils were then subjected to a series of surge tests, dissipation factor testing, voltage endurance and high voltage breakdown. A summary of the test results, conclusions and observations are included in this report.
Keywords
coils; copper; epoxy insulation; impregnated insulation; insulation testing; mica; process monitoring; surges; Asian manufacturers; European manufacturers; anhydride epoxy resin; copper; dissipation factor testing; high voltage breakdown; high voltage multiturn coils; manufacturing process; mica; polyester glass; polyester-amide imide film; process monitoring; surge tests; test coils; turn insulation; uncalcined muscovite wall tape; voltage endurance; Coils; Copper; Cost function; Glass manufacturing; Insulation testing; Manufacturing processes; Monitoring; Production; System testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Technology Conference, 2003. Proceedings
ISSN
0362-2479
Print_ISBN
0-7803-7935-7
Type
conf
DOI
10.1109/EICEMC.2003.1247955
Filename
1247955
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