• DocumentCode
    2323347
  • Title

    Critical thickness of self-assembled Ge quantum dot superlattices

  • Author

    Liu, J.L. ; Wan, J. ; Wang, K.L. ; Yu, D.P.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • fYear
    2002
  • fDate
    15-20 Sept. 2002
  • Firstpage
    351
  • Lastpage
    352
  • Abstract
    In the recent years, there have been considerable attempts to study self-assembled multi-layered Ge quantum dot superlattices for the interest in their novel optoelectronic and thermoelectric properties as well as potential device applications. An interesting feature observed in the multi-layered dot structures was that the dots in the upper layers tended to grow on top of the buried ones, which is attributed to preferential nucleation due to an inhomogeneous strain field induced by buried dots. In this presentation, we show dot evolution characteristics in thick Ge quantum dot superlattices. The study provides strong experimental evidence of the breakdown of the vertical correlation and the growth mode change before and after the reach of the effective critical thickness of superlattices.
  • Keywords
    elemental semiconductors; germanium; molecular beam epitaxial growth; nucleation; photoluminescence; semiconductor epitaxial layers; semiconductor quantum dots; semiconductor superlattices; transmission electron microscopy; 100 nm; 540 C; 600 C; Ge; Ge/Si bilayers; Si [100] substrates; critical thickness; inhomogeneous strain field; multi-layered dot structures; optoelectronic properties; preferential nucleation; self-assembled Ge quantum dot superlattices; thermoelectric properties; Assembly; Capacitive sensors; Electron microscopy; Nonuniform electric fields; Potential well; Quantum dots; Superlattices; Thermoelectric devices; Thermoelectricity; US Department of Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Molecular Beam Epitaxy, 2002 International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-7581-5
  • Type

    conf

  • DOI
    10.1109/MBE.2002.1037904
  • Filename
    1037904