Title :
Growth of ultrahigh mobility SiGe/Ge/SiGe heterostructures with very small parallel conduction and their device application
Author :
Irisawa, T. ; Koh, S. ; Nakagawa, K. ; Shiraki, Y.
Author_Institution :
Dept. of Appl. Phys., Univ. of Tokyo, Japan
Abstract :
Strained Ge channel structures on SiGe virtual substrates are promising for ultrahigh speed p-type devices because of their extremely high hole mobility. We have recently reported that the drift mobility at room temperature (RT) of the 2-dimensional hole gas (2DHG) in strained Ge channels reaches to as high as 2940 cm/sup 2//Vs, which confirmed, for the first time, the expected mobility increase higher than the bulk Ge mobility, due to the strain. However, in samples reported so far, there exists a large amount of parallel conduction in thick SiGe buffer layers, which significantly decreased the overall mobility (RT Hall mobility was around 1300 cm/sup 2//Vs) and degraded the device performances. In this study, to overcome this problem, we employed Sb doping in Si/sub 0.3/Ge/sub 0.7/ buffer layers and successfully obtained almost parallel conduction free strained Ge channel structures.
Keywords :
Ge-Si alloys; Hall mobility; antimony; elemental semiconductors; germanium; hole mobility; molecular beam epitaxial growth; semiconductor growth; semiconductor heterojunctions; semiconductor materials; two-dimensional hole gas; 2-dimensional hole gas; 2DHG; Hall mobility; Sb doping; Si/sub 0.3/Ge/sub 0.7/ buffer layer; Si/sub 0.3/Ge/sub 0.7/:Sb-Ge-GeSi; SiGe virtual substrates; device application; drift mobility; free strained Ge channel structures; high hole mobility; parallel conduction; room temperature; small parallel conduction; solid source molecular beam epitaxy; strained Ge channel structures; ultrahigh mobility SiGe/Ge/SiGe heterostructures; Atomic layer deposition; Buffer layers; Doping; Etching; Germanium silicon alloys; Hall effect; Silicon germanium; Solids; Substrates; Temperature;
Conference_Titel :
Molecular Beam Epitaxy, 2002 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7581-5
DOI :
10.1109/MBE.2002.1037927