DocumentCode :
2325759
Title :
3D temperature distribution of SiC MESFET using Green´s function
Author :
Islam, M.S. ; Akanda, Rakibul Karim
Author_Institution :
Dept. of Electr. & Electron. Eng., Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh
fYear :
2010
fDate :
18-20 Dec. 2010
Firstpage :
13
Lastpage :
16
Abstract :
A three-dimensional (3D) analytical model is derived in this paper to predict the temperature distribution in silicon carbide (SiC) MESFET. The analytical results are almost similar to the simulation results obtained by Atlas. The model describes the influence of the structural parameter and input power on temperature distribution. In some previous papers, analytical solution was obtained by the customary variable-separation method where a long calculation is needed. But by using Green´s function, we get a model that is many times faster and even hand calculation is possible. The results can be used for optimization of the thermal design of SiC MESFET.
Keywords :
Green´s function methods; Schottky gate field effect transistors; optimisation; semiconductor device models; silicon compounds; temperature distribution; wide band gap semiconductors; 3D temperature distribution; Green´s function; MESFET; SiC; customary variable-separation method; thermal design; Atlas; Green´s function; SiC MESFET; variable-separation method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Computer Engineering (ICECE), 2010 International Conference on
Conference_Location :
Dhaka
Print_ISBN :
978-1-4244-6277-3
Type :
conf
DOI :
10.1109/ICELCE.2010.5700541
Filename :
5700541
Link To Document :
بازگشت