Title :
Thermoelectric properties of β-Zn4Sb3 doped with Sn
Author :
Koyanagi, T. ; Hino, K. ; Nagamoto, Y. ; Yoshitake, H. ; Kishimoto, K.
Author_Institution :
Dept. of Electr. & Electron. Eng., Yamaguchi Univ., Ube, Japan
Abstract :
We have tried to dope β-Zn4Sb3 with Sn for the purpose of the p-type doping and the enhancement of phonon scattering, which further improve the thermoelectric properties of βZn4Sb3. Polycrystalline samples doped with Sn were prepared by the spark plasma sintering method. Although no other phase was observed except for β-Zn4Sb3 in Sn-doped samples up to 3%, their lattice constants were not at all changed from that of bulk β-Zn4Sb3, indicating that Sn was not unfortunately substituted for Sb. These results suggest that microcrystals of Sn is dispersed in grain boundary regions of β-Zn4Bb3. The Seebeck coefficient was almost unchanged, and the electrical conductivity was slightly decreased by doping β-Zn4Sb3 with Sn, indicating that Sn does not act as a dopant. On the other hand the thermal conductivity was lowered from 8.66mW/cmK of the non-doped sample to 6.88mW/cmK of the 3% Sn-doped sample at room temperature. This lowering of the thermal conductivity was considered to be due to the point defect phonon scattering induced by inclusions of Sn
Keywords :
Seebeck effect; electrical conductivity; inclusions; lattice constants; phonon-defect interactions; point defect scattering; semiconductor doping; semiconductor materials; thermal conductivity; tin; zinc compounds; β-Zn4Sb3:Sn; Seebeck coefficient; Sn-doped samples; Zn4Sb3:Sn; doped polycrystalline samples; electrical conductivity; grain boundary regions; inclusions; lattice constants; microcrystals; p-type doping; phonon scattering; point defect phonon scattering; room temperature; spark plasma sintering method; thermal conductivity; thermoelectric properties; Doping; Grain boundaries; Lattices; Phonons; Plasma properties; Scattering; Sparks; Thermal conductivity; Thermoelectricity; Tin;
Conference_Titel :
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location :
Dresden
Print_ISBN :
0-7803-4057-4
DOI :
10.1109/ICT.1997.667186