• DocumentCode
    2326678
  • Title

    Measurements and simulations of scattering for propagation modeling at THz frequencies

  • Author

    Piesiewicz, Radoslaw ; Jansen, C. ; Mittleman, Daniel M. ; Kleine-Ostmann, Thomas

  • Author_Institution
    TU Braunschweig, Braunschweig
  • fYear
    2007
  • fDate
    9-15 June 2007
  • Firstpage
    5559
  • Lastpage
    5562
  • Abstract
    In Piesiewicz et al., (2005), we proposed an efficient method to model reflective properties of smooth building materials at THz frequencies. It is based on Fresnel equations, which are applied to measured material parameters to account for frequency dependence. However, this technique is adequate for smooth materials only as it neglects scattering losses.The method can be extended to rough materials with Kirchoff theory of scattering from rough surfaces. In order to account for scattering losses in the specular direction, the reflection coefficient, derived from Fresnel equations can be multiplied with a Rayleigh roughness factor. This factor can be obtained from measured surface roughness data of the investigated material. Here, we show the model and direct reflection measurements for a set of angles of incidence for two common rough building materials: ingrain wallpaper and concrete plaster.
  • Keywords
    Fresnel diffraction; building materials; electromagnetic wave reflection; electromagnetic wave scattering; radiowave propagation; rough surfaces; Fresnel equations; Rayleigh roughness factor; concrete plaster; direct reflection measurements; ingrain wallpaper; material parameters; propagation modeling; reflective properties; rough building materials; rough surfaces; scattering losses; smooth building materials; Building materials; Frequency measurement; Fresnel reflection; Optical reflection; Optical scattering; Optical surface waves; Rayleigh scattering; Reflector antennas; Rough surfaces; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2007 IEEE
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-0877-1
  • Electronic_ISBN
    978-1-4244-0878-8
  • Type

    conf

  • DOI
    10.1109/APS.2007.4396808
  • Filename
    4396808