Title :
The influence of a top cover on the leakage from microstrip line
Author :
Mesa, F. ; Oliner, A.A. ; Jackson, D.R. ; Freire, M.J.
Author_Institution :
Seville Univ., Spain
Abstract :
When a microwave integrated circuit is enclosed in a package, the top cover causes the transmission lines used in the circuit to become leaky at a lower frequency than otherwise. This effect is found to be particularly dramatic for microstrip line, and the leakage is strong enough to produce crosstalk that can ruin the performance of the circuit.
Keywords :
Crosstalk; Integrated circuit packaging; Microstrip lines; Microwave integrated circuits; IC package; MIC; crosstalk; leaky transmission lines; microstrip line leakage; microwave IC; microwave integrated circuit; top cover; Crosstalk; Dielectric substrates; Distributed parameter circuits; Frequency; Integrated circuit packaging; Microstrip; Microwave integrated circuits; Power transmission lines; Solids; Surface waves;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.862298
