Title :
A new concept of RF feed-through applied to multichip modules for space equipment
Author :
Monfraix, P. ; Adam, T. ; Drevon, C. ; Naudy, G. ; Cogo, B. ; Roux, J.L.
Author_Institution :
Alcatel Space Ind., Toulouse, France
Abstract :
This paper presents the electrical design and measurement of a new microwave transition for MMIC packages, fully integrated in the fabrication process of multichip modules. Electrical simulations show very good results up to 27 GHz. Test samples have been realised with standard design rules from the MCM-C manufacturer on aluminium nitride substrate and electrical measurements up to 20 GHz show the same insertion losses as current RF feed-throughs.
Keywords :
Integrated circuit packaging; Losses; MMIC; Multichip modules; Space vehicle electronics; Waveguide transitions; 0 to 27 GHz; AlN; MMIC packages; RF feed-through; electrical design; insertion losses; microwave transition; multichip modules; space equipment; Electric variables measurement; Fabrication; MMICs; Manufacturing; Measurement standards; Microwave measurements; Multichip modules; Packaging; Radio frequency; Testing;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.862349
