Title :
A low-cost, compact-size 10-Gigabit Ethernet optical sub-assembly using a novel opto-electronic hybrid integration platform
Author :
Miyoshi, K. ; Sugimoto, Taku ; Kurata, K. ; Kami, N. ; Tanaka, K. ; Yamamoto, K. ; Kurihara, M. ; Watanabe, T.
Author_Institution :
Networking Res. Labs., NEC Corp., Tsukuba, Japan
Abstract :
A novel opto-electronic hybrid integration platform using a flexible resin interposer on a silicon substrate has achieved low-cost, compact-size optical sub-assemblies. A 10 km error-free-transmission has been demonstrated with the optical sub-assemblies for 10-Gigabit Ethernet transceivers.
Keywords :
elemental semiconductors; integrated optoelectronics; optical fibre LAN; resins; silicon; substrates; transceivers; 10 Gbits/s; 10 km; Ethernet transceivers; error-free-transmission; flexible resin interposer; optical sub-assembly; opto-electronic hybrid integration platform; silicon substrate; Ethernet networks; High speed optical techniques; Integrated optics; Laboratories; National electric code; Optical devices; Packaging; Resins; Silicon; Transceivers;
Conference_Titel :
Optical Fiber Communications Conference, 2003. OFC 2003
Print_ISBN :
1-55752-746-6
DOI :
10.1109/OFC.2003.1248346
