Title :
The future of high frequency circuit design
Author_Institution :
California Inst. of Technol., Pasadena, CA, USA
Abstract :
The cut-off wavelengths of integrated silicon transistors have exceeded the die sizes of the chips being fabricated with them. Combined with the ability to integrate billions of transistors on the same die, this size-wavelength cross-over has produced a unique opportunity for a completely new class of holistic circuit design combining electromagnetics, device physics, circuits, and communication system theory in one place. In this paper, we discuss some of these opportunities and their associated challenges in greater detail and provide a few of examples of how they can be used in practice.
Keywords :
MIMIC; integrated circuit design; millimetre wave transistors; Si; chip fabrication; high frequency circuit design; holistic circuit design; integrated silicon transistor; millimetre wave transistor; mm-wave integrated circuit; Capacitors; Circuit synthesis; Electromagnetic devices; Electromagnetic fields; Frequency; Kirchhoff´s Law; MMICs; Physics; Radar applications; Silicon;
Conference_Titel :
ESSCIRC, 2009. ESSCIRC '09. Proceedings of
Conference_Location :
Athens
Print_ISBN :
978-1-4244-4354-3
DOI :
10.1109/ESSCIRC.2009.5325926
