DocumentCode :
2328927
Title :
Silicon Technology Roadmap To 2010
Author :
Seidel, T.E.
Author_Institution :
SEMATECH
fYear :
1994
fDate :
21-22 June 1994
Firstpage :
14
Lastpage :
17
Abstract :
An analysis of the Silicon Technology Roadmap out to 2010 is presented. Partnering (this conference theme) is fundamental to the success of meeting the Roadmap goals. Escalating cost has been globally identified as a common enemy, key partnership opportunities exist in the areas of lithography, wafer contamination and environmental technologies. These opportunities are being developed against a background of adverse trade policies.
Keywords :
Application specific integrated circuits; Cost function; Logic; Manufacturing; Microprocessors; Power supplies; Probes; Silicon; Testing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location :
Tokyo, Japan
Type :
conf
DOI :
10.1109/ISSM.1994.729413
Filename :
729413
Link To Document :
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