DocumentCode
2328927
Title
Silicon Technology Roadmap To 2010
Author
Seidel, T.E.
Author_Institution
SEMATECH
fYear
1994
fDate
21-22 June 1994
Firstpage
14
Lastpage
17
Abstract
An analysis of the Silicon Technology Roadmap out to 2010 is presented. Partnering (this conference theme) is fundamental to the success of meeting the Roadmap goals. Escalating cost has been globally identified as a common enemy, key partnership opportunities exist in the areas of lithography, wafer contamination and environmental technologies. These opportunities are being developed against a background of adverse trade policies.
Keywords
Application specific integrated circuits; Cost function; Logic; Manufacturing; Microprocessors; Power supplies; Probes; Silicon; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location
Tokyo, Japan
Type
conf
DOI
10.1109/ISSM.1994.729413
Filename
729413
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