DocumentCode
2329180
Title
Advanced modeling of packaged RF MEMS switches and its application on tunable filter implementation
Author
Entesari, Kamran
Author_Institution
Electr. & Comput. Eng., Texas A&M Univ., College Station, TX, USA
fYear
2010
fDate
12-13 April 2010
Firstpage
1
Lastpage
5
Abstract
This paper presents advanced modeling of a packaged RF MEMS switch considering the effect of packaging, mounting pad and bond-wires. The importance of the switch advanced model for accurate prediction of tunable filter response is also investigated for three different types of RF MEMS tunable filters; a lumped element 25-75 MHz tunable filter, an inductively-loaded microstrip 1.06-1.23 GHz tunable filer and a surface-integrated-waveguide 1.8-2.3 GHz tunable filter.
Keywords
UHF filters; microstrip filters; microswitches; waveguide filters; RF MEMS tunable filters; bond-wires; frequency 1.06 GHz to 1.23 GHz; frequency 1.8 GHz to 2.3 GHz; frequency 25 MHz to 75 MHz; inductively-loaded microstrip tunable filter; mounting pad; packaged RF MEMS switches; surface-integrated-waveguide tunable; Filters; Packaging; Radiofrequency microelectromechanical systems; Switches; RF MEMS; circuit model; micro-switch; packaging; tunable filter;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless and Microwave Technology Conference (WAMICON), 2010 IEEE 11th Annual
Conference_Location
Melbourne, FL
Print_ISBN
978-1-4244-6688-7
Type
conf
DOI
10.1109/WAMICON.2010.5461855
Filename
5461855
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