Ultra-broadband integration techniques for high-speed circuits and systems design

Author

Franklin, Rhonda R. ; Kim, Hosaeng ; Cho, Young Seek

Author_Institution

Univ. of Minnesota, Minneapolis, MN, USA

fYear

2010

fDate

12-13 April 2010

Firstpage

1

Lastpage

4

Abstract

This paper will describe methods developed to enhance the effective integration of complex systems. A variety of integration techniques will be described for coplanar waveguide based architectures used for in-plane and three-dimensional wafer scale packaging. Each approach offers low loss and low dispersion characteristics from DC to V-band and in special cases W-band.

Keywords

high-speed integrated circuits; planar waveguides; ultra wideband technology; wafer level packaging; complex systems; coplanar waveguide; dispersion characteristics; frequency 0 GHz to 110 GHz; high-speed circuits; in-plane wafer scale packaging; loss characteristics; three-dimensional wafer scale packaging; ultrabroadband integration techniques; Circuits and systems; Coplanar waveguides; Dielectric constant; Filters; Impedance; Integrated circuit interconnections; Parasitic capacitance; Radio frequency; Signal design; Silicon; Silicon; V-band; W-band; coplanar waveguide; filters; flip-chip; integration; silicon micromachining;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless and Microwave Technology Conference (WAMICON), 2010 IEEE 11th Annual

Conference_Location

Melbourne, FL

Print_ISBN

978-1-4244-6688-7

Type

conf

DOI

10.1109/WAMICON.2010.5461856

Filename

5461856