DocumentCode :
2329362
Title :
Challenges for silicon technology scaling in the Nanoscale Era
Author :
Chen, Tze-Chiang
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2009
fDate :
14-18 Sept. 2009
Firstpage :
1
Lastpage :
7
Abstract :
The continuous and systematic increase in transistor density and performance, as described in ldquoMoore´s Lawrdquo and guided by CMOS scaling theory, has been remarkably successful for the development of silicon technology for the past 40 years. As the silicon industry moves into sub-ten nanometer dimensions, significant technology challenges in device performance, power dissipation, and variability will be imposed by the approach toward atomistic and quantum-mechanical physics boundaries. These issues are frequently cited as the reason Moore´s Law is ldquobrokenrdquo, or why CMOS scaling is coming to an end. However, the infusion of new materials, device structures, and the exploitation of 3D-silicon integration, coupled with innovations in circuit design and system architecture, will ensure several more generations of continued CMOS development.
Keywords :
CMOS integrated circuits; elemental semiconductors; nanotechnology; quantum theory; silicon; 3D-silicon integration exploitation; CMOS scaling theory; Moore law; Si; atomistic approach; circuit design; continued CMOS development; device performance; device structures; device variability; material infusion; nanoscale era; power dissipation; quantum-mechanical physics boundary; silicon technology scaling; system architecture; transistor density; CMOS technology; Composite materials; Compressive stress; Inorganic materials; MOSFETs; Moore´s Law; Nanoscale devices; Semiconductor materials; Silicon; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ESSCIRC, 2009. ESSCIRC '09. Proceedings of
Conference_Location :
Athens
ISSN :
1930-8833
Print_ISBN :
978-1-4244-4354-3
Type :
conf
DOI :
10.1109/ESSCIRC.2009.5325955
Filename :
5325955
Link To Document :
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