Title :
Safety Measures And Their Cost Reduction Of Semiconductor Equipment
Author :
Uchino, Toshiyuki ; Shida, Hiroyuki
Author_Institution :
Hitachi, Ltd.
Abstract :
Cost reduction of semiconductor equipment by streamlining safety measures is discussed. Unification of equipment specifications, elimination of over-specification, and maximum use of vendor options are the major guidelines for cost reduction. Consequently the average equipment price has decreased by 20%.
Keywords :
Costs; Guidelines; Manufacturing; Product safety; Production; Productivity; Protection; Safety devices; Semiconductor materials; Throughput;
Conference_Titel :
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location :
Tokyo, Japan
DOI :
10.1109/ISSM.1994.729436
