DocumentCode
2329427
Title
Safety Measures And Their Cost Reduction Of Semiconductor Equipment
Author
Uchino, Toshiyuki ; Shida, Hiroyuki
Author_Institution
Hitachi, Ltd.
fYear
1994
fDate
21-22 June 1994
Firstpage
121
Lastpage
122
Abstract
Cost reduction of semiconductor equipment by streamlining safety measures is discussed. Unification of equipment specifications, elimination of over-specification, and maximum use of vendor options are the major guidelines for cost reduction. Consequently the average equipment price has decreased by 20%.
Keywords
Costs; Guidelines; Manufacturing; Product safety; Production; Productivity; Protection; Safety devices; Semiconductor materials; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location
Tokyo, Japan
Type
conf
DOI
10.1109/ISSM.1994.729436
Filename
729436
Link To Document