DocumentCode :
2329440
Title :
Eouipment Modeling: A Tool To Cost Reduction
Author :
Alvi, N.S.
Author_Institution :
SEMATECH
fYear :
1994
fDate :
21-22 June 1994
Firstpage :
123
Lastpage :
128
Abstract :
Complexities in manufacturing and needs for cost containment have spawned a drive to develop accurate and efficient modeling techniques. These range from addressing market scenarios and factory performance at the strategic level to the performance of individual equipment at the tactical level, such as throughput, clustering and reliability. The modeling of individual equipment and process is an important link in the overall drive to comprehend and reduce cost factors at the factory level. This paper describes the application of analytical and computational modeling techniques used to optimize process and equipment design of furnace, chemical vapor deposition (CVD), rapid thermal processing (RTP), and plasma etch and deposition equipment.
Keywords :
Chemical vapor deposition; Computational modeling; Costs; Design optimization; Etching; Plasma applications; Plasma chemistry; Plasma materials processing; Process design; Production facilities;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1994. Extended Abstracts of ISSM '94. 1994 International Symposium on
Conference_Location :
Tokyo, Japan
Type :
conf
DOI :
10.1109/ISSM.1994.729437
Filename :
729437
Link To Document :
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