Thermal optimization of a flip-chip WiFi RF front-end IC

Author

Laursen, Kirk ; Yuen, Cindy ; Adams, Mark ; Chu, Due ; Chen, Huanting ; Pao, Yi-ching

Author_Institution

Epic Commun., Inc., Sunnyvale, CA, USA

fYear

2010

fDate

12-13 April 2010

Firstpage

1

Lastpage

4

Abstract

Flip-chip designs offer several advantages over traditional designs. However, thermal characteristics must be considered carefully, or the end result may have high junction temperatures and thus poor performance and poor reliability. This paper presents some guidelines for thermal optimization in flip-chip designs, and presents the results of a flip-chip single die WiFi FEM developed using Bi-FET (HBT+E/D-PHEMT) technology. In this design, both solder bumps and copper pillar bumps were developed for the flip chip process.

Keywords

flip-chip devices; optimisation; radiofrequency integrated circuits; solders; thermal management (packaging); wireless LAN; Bi-FET; copper pillar bumps; flip-chip WiFi RF front-end IC; solder bumps; thermal optimization; Computer architecture; Degradation; Doppler radar; Electric variables measurement; Frequency measurement; Motion measurement; Phase modulation; Radar detection; Radio frequency; Radiofrequency integrated circuits; Copper Pillar; Flip-Chip; Front-End IC; Solder Bump; Thermal Optimization; WiFi;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless and Microwave Technology Conference (WAMICON), 2010 IEEE 11th Annual

Conference_Location

Melbourne, FL

Print_ISBN

978-1-4244-6688-7

Type

conf

DOI

10.1109/WAMICON.2010.5461884

Filename

5461884