DocumentCode
2329873
Title
A fast and high-capacity electromagnetic solution for high- speed IC design
Author
Gan, Houle ; Jiao, Dan
Author_Institution
Purdue Univ. West Lafayette, Lafayette
fYear
2007
fDate
4-8 Nov. 2007
Firstpage
1
Lastpage
6
Abstract
This paper proposes a fast and high-capacity electromagnetic solution, time-domain layered finite element reduction recovery (LAFE-RR) method, for high-frequency modeling and simulation of large-scale on-chip circuits. This method rigorously reduces the matrix of a multilayer system to that of a single-layer one regardless of the original problem size. More important, the matrix reduction is achieved analytically, and hence the CPU and memory overheads are minimal. The recovery of solutions in all other layers involves only forward and backward substitution of matrices of single-layer size. The memory cost is also modest-requiring only the memory needed for the factorization of a single layer sparse matrix. The improved performance applies to any arbitrarily shaped multilayer structure. Numerical and experimental results are presented to demonstrate the accuracy, efficiency, and capacity of the proposed method.
Keywords
electromagnetic devices; finite element analysis; integrated circuit design; sparse matrices; time-domain analysis; high-capacity electromagnetic solution; high-speed IC design; large-scale onchip circuits; memory overheads; multilayer system matrix; single layer sparse matrix; time-domain layered finite element reduction recovery; Central Processing Unit; Circuit simulation; Costs; Electromagnetic modeling; Finite element methods; High speed integrated circuits; Large-scale systems; Nonhomogeneous media; Sparse matrices; Time domain analysis; High capacity; IC; electromagnetics; finite element method; modeling; simulation; time domain;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-4244-1381-2
Electronic_ISBN
1092-3152
Type
conf
DOI
10.1109/ICCAD.2007.4397235
Filename
4397235
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