DocumentCode :
2329880
Title :
Impedance extraction for 3-D structures with multiple dielectrics using preconditioned boundary element method
Author :
Yi, Yang ; Li, Peng ; Sarin, Vivek ; Shi, Weiping
Author_Institution :
Texas A&M Univ., College Station
fYear :
2007
fDate :
4-8 Nov. 2007
Firstpage :
7
Lastpage :
10
Abstract :
In this paper, we present the first BEM impedance extraction algorithm for multiple dielectrics. The effect of multiple dielectrics is significant and efficient modeling is challenging. However, previous BEM algorithms, including Fastlmp and EastPep, assume uniform dielectric, thus causing considerable errors. The new algorithm introduces a circuit formulation which makes it possible to utilizes either multilayer Green´s function or equivalent charge method to extract impedance in multiple dielectrics. The novelty of the formulation is the reduction of the number of unknowns and the application of the hierarchical data structure. The hierarchical data structure permits efficient sparsification transformation and preconditioners to accelerate the linear equation solver. Experimental results demonstrate that the new algorithm is accurate and efficient. For uniform dielectric problems, the new algorithm is one magnitude faster than Fastlmp, while its results differ from Fastlmp within 2%. For multiple dielectrics problems, its relative error with respect to HFSS is below 3%.
Keywords :
Green´s function methods; boundary-elements methods; circuit CAD; data structures; dielectric materials; multilayers; 3-D structures; BEM impedance extraction algorithm; equivalent charge method; hierarchical data structure; linear equation; multilayer Green´s function; multiple dielectrics; preconditioned boundary element method; sparsification transformation; Acceleration; Boundary element methods; Circuits; Data mining; Data structures; Dielectrics; Equations; Green´s function methods; Impedance; Nonhomogeneous media;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
ISSN :
1092-3152
Print_ISBN :
978-1-4244-1381-2
Electronic_ISBN :
1092-3152
Type :
conf
DOI :
10.1109/ICCAD.2007.4397236
Filename :
4397236
Link To Document :
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