• DocumentCode
    2332380
  • Title

    Data-fitting reconstruction for defect inspection of airplane aluminum structure in infrared thermographic NDT

  • Author

    Wan, Kai ; Ma, Qishuang

  • Author_Institution
    Sch. of Autom. Sci. & Electr. Eng., Beijing Univ. of Aeronaut. & Astronaut., Beijing
  • fYear
    2009
  • fDate
    25-27 May 2009
  • Firstpage
    691
  • Lastpage
    696
  • Abstract
    Infrared (IR) thermography has already demonstrated to be an effective tool for nondestructive testing and evaluation (NDT & E) applications. Pulsed thermography (PT) is such kind of technique often used in rapid and wide-area sub-surface inspection. In aviation industry, metal structures of aluminum, which has high thermal conductivity and diffusivity, usually need to be verified in material integrality both for manufacture and maintenance. And it is generally difficult to get sufficient noise-free sampling data for an accurate analysis due to swift heat conduction in material of high thermal conductivity, if the IR device is not good enough for a high sampling rate. So a data-fitting process is offered to reconstruct the sequence from a PT test for cost-effective detection by a commercial mediocre infrared imaging system. This method brings two evident advantages: increased image quality by reducing temporal stochastic noise, and discretionary number of reconstructed frame at any precision for quantitative analysis. A particular specimen of duralumin is machined to emulate airplane components. And experimental difference curves and images are given, behaving well to indicate the validity of this economical inspection.
  • Keywords
    aerospace materials; aircraft; aluminium alloys; condition monitoring; failure analysis; infrared imaging; nondestructive testing; airplane aluminum structure; aviation industry; data fitting reconstruction; defect inspection; infrared thermography; material integrality; nondestructive evaluation; nondestructive testing; thermal conductivity; wide area subsurface inspection; Airplanes; Aluminum; Conducting materials; Image reconstruction; Inorganic materials; Inspection; Manufacturing industries; Metals industry; Nondestructive testing; Thermal conductivity; NDT; data-fitting; thermography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications, 2009. ICIEA 2009. 4th IEEE Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-2799-4
  • Electronic_ISBN
    978-1-4244-2800-7
  • Type

    conf

  • DOI
    10.1109/ICIEA.2009.5138294
  • Filename
    5138294