DocumentCode :
2332798
Title :
A planar-type leakage current and impedance microsensor for detection of interaction between electrolyte-entrapping liposome and protein
Author :
Ohara, Y. ; Lorchirachoonkul, P. ; Yamashita, K. ; Noda, M. ; Alberto, O.A. ; Shimanouchi, T.
Author_Institution :
Grad. Sch. of Sci. & Technol., Kyoto Inst. of Technol., Kyoto, Japan
fYear :
2012
fDate :
9-11 May 2012
Firstpage :
1
Lastpage :
2
Abstract :
We have developed a new leakage current microsensor by using simpler planar processes than Si-surface-bulk micromachining processes used in the previous microwell structure. This sensor fabrication and structure can easily make a target solution volume smaller than μL with excellent immobilization of the droplet and intact biomolecules as sensing elements, as a result, reduce effectively the background noise current in the microsensor and improve reproducibility of the results. The leakage current due to the biochemical interaction was successfully evaluated. Cole-Cole plots from the impedance analysis also show quantitative difference between with and without the interaction, depending on the charge-transfer impedance.
Keywords :
bioMEMS; biochemistry; biosensors; drops; electric impedance; leakage currents; micromachining; microsensors; molecular biophysics; proteins; Cole-Cole plots; Si-surface bulk micromachining processes; background noise current; biochemical interaction; biomolecules; charge-transfer impedance; droplet immobilization; electrolyte-entrapping liposome; impedance analysis; impedance microsensor; interaction detection; leakage current microsensor; microwell structure; planar-type leakage current; protein; sensing elements; sensor fabrication; simpler planar processes; target solution; Fabrication; Impedance; Leakage current; Microsensors; Proteins; Surface impedance; electrochemical; impedance; leakage current; liposome; microsensor; protein;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, Kansai (IMFEDK), 2012 IEEE International Meeting for
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-0837-3
Type :
conf
DOI :
10.1109/IMFEDK.2012.6218624
Filename :
6218624
Link To Document :
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