DocumentCode :
2336105
Title :
Electrode protrusions and particle chaining as factors affecting the dielectric strength of air
Author :
Dascalescu, L. ; Tobazéon, R.
Author_Institution :
Inst. Univ. de Technol., Lab. Univ. de Technol. Electr. et Electron. Avancees, Angouleme, France
Volume :
3
fYear :
1998
fDate :
12-15 Oct. 1998
Firstpage :
1994
Abstract :
Electrode protrusions and free particles have been demonstrated to reduce dramatically the breakdown voltage of insulating fluids. This paper examines two factors which affect the dielectric strength of gaseous insulators: (i) shape and size of electrode protrusions; and (ii) particle chain formation. A computer program, based on the boundary element method, was employed for the computation of the electric field modified by an electrode protrusion and/or a particle chain. The results regarding field enhancement were used as input data of another program that evaluated the dielectric strength of the air-gap. Two types of protrusions were studied: hemispheres and hemispherically-ended rods. One to ten conductive spheres were considered to be attracted to such protrusions and chain at the top of them. The computations showed that the large protrusions are more harmful than the small ones and that the dielectric strength of the air-gap decreases with the number of particles in a chain.
Keywords :
air gaps; boundary-elements methods; electric fields; electric strength; electrical engineering computing; electrodes; air insulation; air-gap; boundary element method; breakdown voltage; computer program; conductive spheres; dielectric strength; electric field; electrode protrusion shape; electrode protrusion size; electrode protrusions; field enhancement; free particles; gaseous insulators; hemispheres; hemispherically-ended rods; input data; particle chain formation; particle chaining; Air gaps; Boundary element methods; Contamination; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Gas insulation; Shape; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location :
St. Louis, MO, USA
ISSN :
0197-2618
Print_ISBN :
0-7803-4943-1
Type :
conf
DOI :
10.1109/IAS.1998.729883
Filename :
729883
Link To Document :
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