Research for curing process of mica-containing epoxy resin-TOA system with dynamic dielectric spectroscopy

Author

Ling, Chen ; Guiyun, Liu

Author_Institution

Dept. of Chem. Eng., Zhejiang Inst. of Technol., Hangzhou, China

fYear

1989

fDate

29 Oct-2 Nov 1989

Firstpage

392

Lastpage

397

Abstract

The curing process of the mica-containing epoxy resin-TOA (tung oil anhydride) system was measured with a dielectric spectrometer at increasing temperatures. The theoretical analysis of the results of this dielectric spectroscopy and their experimental verification are presented. By processing the data of the tan δ versus T graph, the functional relation between the characteristic values T _b, T_m of the spectroscopy and the curing reaction dynamic parameters E, k, t is established. By choosing a suitable frequency, the peak time on the tan δ-T spectroscopy is made equal to the gel time. It is concluded that this dielectric analysis at increasing temperatures makes it not only possible to study the curing characteristics of the curing reaction system but also to monitor and control the production of the stator windings of motors

Keywords

composite insulating materials; dielectric losses; filled polymers; materials preparation; mica; reaction kinetics; curing process; dielectric loss tangent; dynamic dielectric spectroscopy; gel time; gelation peak; mica containing epoxy resin tung oil anhydride; peak time; production; stator windings of motors; Control systems; Curing; Dielectric measurements; Electrochemical impedance spectroscopy; Frequency; Monitoring; Petroleum; Production systems; Stator windings; Temperature control;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 1989. Annual Report., Conference on

Conference_Location

Leesburg, VA

Type

conf

DOI

10.1109/CEIDP.1989.69578

Filename

69578