Title :
[Front and back cover]
Abstract :
The following topics are dealt with: therminator special session; package thermal issues session; reliability session; advanced cooling methods; and thermal characterization and measurement session.
Keywords :
cooling; integrated circuit packaging; reliability; thermal analysis; thermal engineering; IC thermal investigation; advanced cooling method; package thermal issues; reliability; therminator special session;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
Conference_Location :
Paris
Print_ISBN :
978-1-4577-0778-0
