DocumentCode
2337122
Title
[Front and back cover]
fYear
2011
fDate
27-29 Sept. 2011
Abstract
The following topics are dealt with: therminator special session; package thermal issues session; reliability session; advanced cooling methods; and thermal characterization and measurement session.
Keywords
cooling; integrated circuit packaging; reliability; thermal analysis; thermal engineering; IC thermal investigation; advanced cooling method; package thermal issues; reliability; therminator special session;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
Conference_Location
Paris
Print_ISBN
978-1-4577-0778-0
Type
conf
Filename
6081004
Link To Document